With the Galaxy S7 getting closer to its rumored launch in February, more and more rumors and leaks related to this device are happening. The latest one shows us a few pictures of the handset’s chassis, that you can check out below.
The come from China and follow a series of measurements and CAD renders coming from case makers. The chassis here is metallic and seems to include an USB type C port at the bottom. The edges are very much like the ones of the Galaxy S6 and the format should remain the same. The source of the pictures also confirms that the Snapdragon 820 will be the main chipset on the handset, while the Exynos will be the secondary one.
Production is supposed to start in January and the case will be slimmer than the one of the Galaxy S6. Meanwhile, Galaxy S7 Plus is still on the table, with a 7.82 mm waistline, 163.32 mm length and 82.01 mm width. Some say we may get a 6 inch 4K display on board, plus the same Snapdragon 820 chipset. It remains to be seen if Samsung will keep the glass back on the new models, seeing how even the new Galaxy A units have this feat. Also, is it me or does this device pictured here look really wide?
via Mobilissimo.ro
